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Archives for AEC

Autodesk Integrates PlanGrid with BuildingConnected—Streamlines Preconstruction and Field Teams

Building on the momentum of product consolidation, new Autodesk integration instantly pushes critical preconstruction data from BuildingConnected to PlanGrid, saving time and reducing mistakes.

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Profile: Design Excellence—The Work of Vectorworks Scholarship Winners

The Vectorworks Design Scholarship offers lucrative prizes but its student winners show us just how talented and deserving their creative work really is.

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Early Access: (emTech) section for INSIDER Expresso—#06

Early Access coverage of the Emergent Technologies (emTech) section for the upcoming INSIDER Xpresso #06. Non-subscribers can gain access to this information by signing up for our monthly Xpresso newsletter for free. Inside this issue, we cover new Parametric tools in Architecture, Robots in Architecture and Construction and new Neuroscience insights to help you balance your career path.

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Nemetschek Group Quarter 2 Earnings Out—Strong Dynamic Growth

The Nemetschek Group has posted strong second-quarter earnings with revenue up 21 percent and high operating margins of 29 percent. The Group is on target for the fiscal year.

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GRAPHISOFT offers new #graphisoftLEARN Master Classes—exceptional learning for BIM professionals

New 2-day conference in Budapest, Hungary—#graphisoftLEARN Master Classes will offer BIM professionals exceptional learning opportunity.

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Open Design Alliance (ODA) to showcase BIM solutions in Milan

ODA DevCon 19 will be highlighting support for open and proprietary BIM formats.

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Perspectives on AIA ’19—Technology and Architecture and Toward the Collective

Architosh presents its annual “perspectives” on BEST of SHOW honorees at AIA in Las Vegas. This year the focus on AEC technologies advances in the framework of last year’s efforts, recognizing the continuity and the developments we saw and awarded around the themes of the conference: collaboration, openness, and inclusiveness…toward the collective.

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C3d Labs Unveils B-Shaper for AEC and BIM Developers

C3D Labs adds innovative Mesh to B-Rep editor and converter to its API Toolkit.

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ODA Toolkit Will Allow Generation of Revit Model Files from Any Application

Export Autodesk Revit files to JSON and OBJ with the new ODA BimRv SDK 2020.

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Varjo Now Has Vast Reseller Network—Expands VR-1 Device

The program launches with 14 resellers, bringing in-person demos and local support to more than 34 countries across Europe and North America.

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ToolTalk: Catching Up with The Wild—Noted VR Software for Design

The Wild is one of the coolest new AR/VR software packages with several industry-only unique features. We catch up with The Wild in this ToolTalk story and cover several of its latest features arriving earlier this year.

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Open Design Alliance Releases new IFC Software Development Kit (SDK)

The Open Design Alliance announces its first IFC software development kit (SDK). The new toolkit aims to improve IFC implementations throughout the AEC industry.

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Learning IN Las Vegas—Summary Impressions from Two Architecture Conferences

Clear themes loomed large at AIA 19 in Las Vegas. We discuss two of them in the context of technologies and change in the field of architecture.

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GRAPHISOFT’s ARCHICAD 23 and BIMx win AIA ‘Best of Show’ Awards

GRAPHISOFT wins two top honors for ‘BEST of SHOW’ at AIA, Las Vegas, Nevada.

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Vectorworks, Inc. Adds Two Prestigious Awards from Architosh and BUILD Magazine

Company recognized as “BEST of SHOW” and “Ones to Watch”

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INSIDER Xpresso keeps CAD industry professionals up-to-date on next-gen emerging technologies (emTech) that will revolutionize the worlds of AEC and manufacturing and design. As an Xpresso reader, you will hear from some of the most important voices inventing and using the very latest tech in areas such as AI, machine learning, algorithmic-aided design (AAD), AR, VR, MR, 3D printing, 3D computer vision, robotics, and SmartCities technologies.

Each issue arrives in your inbox on the first Sunday of the month. Issue #1 in your inbox March 3, 2019.

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