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Archives for HOOPS Publish Archives - Architosh

Tech Soft 3D Intros 2021 HOOPS SDKs — Apple M1 Chip Support

Tech Soft 3D announces new HOOPS 2021 product line with better technologies for BIM models, large assembly models, streaming technology, plus beta support for Apple Silicon transition.

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InBrief: Tech Soft 3D releases HOOPS Exchange 7 and Publish 7

A new server licensing option enables Re-Use of CAD data and 3D PDF publishing in cloud-based applications and services

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INSIDER Xpresso keeps CAD industry professionals up-to-date on next-gen emerging technologies (emTech) that will revolutionize the worlds of AEC and manufacturing and design. As an Xpresso reader, you will hear from some of the most important voices inventing and using the very latest tech in areas such as AI, machine learning, algorithm-aided design (AAD), AR, VR, MR, 3D printing, 3D computer vision, robotics, and SmartCities technologies.

Each issue arrives in your inbox on the first Sunday of the month. Issue #1 arrived on March 3, 2019. Full archives and easy navigation for your pleasure. Enjoy! 

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